Apple is gearing up to launch its iPhone 17 series, with exciting advancements in the processing technology. Analyst Jeff Pu recently revealed that the upcoming A19 and A19 Pro chips will utilize TSMC’s cutting-edge third-generation 3nm process, known as “N3P.”
This marks a noteworthy shift from the existing A18 and A18 Pro chips, which are built using TSMC’s second-generation 3nm process, “N3E,” and the A17 Pro chip in the iPhone 15 Pro models, which relies on the first-generation 3nm process, “N3B.” The “N3P” process is anticipated to enhance transistor density, which should lead to improvements in both performance and power efficiency for the iPhone 17 models.
TSMC is expected to commence mass production of the new chips in the latter half of 2024. Looking ahead, Apple plans to adopt TSMC’s first 2nm process for its A20 chips in the iPhone 18 models in 2026.
As the iPhone 17 Pro and Pro Max launch approaches, rumors about these devices are circulating. Notably, there may be a change in the positioning of the Apple logo on the back of the Pro models.
The differences between the Pro and Pro Max will remain significant, with the Pro Max boasting a larger 6.9-inch display compared to the Pro’s 6.3-inch display. This extra size allows for a more substantial battery, with the iPhone 17 Pro Max rumored to feature the largest battery ever in an iPhone at 5,000mAh.
With the impending release, Apple is expected to solidify its position as a leader in the true wireless stereo earbud market and introduce a range of new features across its product lineup.